Abstract
The Al/diamond composite was fabricated using a pressureless infiltration method. The microstructure and physical properties of the composite were investigated. The composite has a very low coefficient of thermal expansion (CTE) of 3·9 × 10−6 K−1. The thermal conductivity (TC) of the composite is 12% higher than that of the Al alloy matrix. The lower TC of the composite than the expected value was attributed to the existence of interfacial low conducting phases and the porocity of the composite.
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