Copper and Silver ion Implantation of Aluminium Oxide-Blasted Titanium Surfaces: Proliferative Response of Osteoblasts and Antibacterial Effects

Implant infection still represents a major clinical problem in orthopedic surgery. We therefore tested the in vitro biocompatibility and antibacterial effects of copper (Cu)- and silver (Ag)-ion implantation. Discs of a commonly used titanium alloy (Ti6AlV4) with an aluminium oxide-blasted surface were treated by Cu- or Ag-ion implantation with different dosage regimen (ranging from 1e15–17 ions cm⁻² at energies of 2–20 keV). The samples were seeded with primary human osteoblasts and cell attachment and proliferation was analyzed by an MTT-assay. In comparison to the reference titanium alloy there was no difference in the number of attached viable cells after two days. After seven days the number of viable cells was increased for Cu with 1e17 ions cm⁻² at 2 and 5 keV, and for Ag with 1e16 ions cm⁻² at 5 keV while it was reduced for the highest amount of Ag deposition (1e17 ions cm⁻² at 20 keV). Antibacterial effects on S.aureus and E.coli were marginal for the studied dosages of Cu but clearly present for Ag with 1e16 ions cm⁻² at 2 and 5 keV and 1e17 ions cm⁻² at 20 keV. These results indicate that Ag-ion implantation may be a promising methodological approach for antibacterial functionalization of titanium implants.